Microstructure and Properties of Bulk Ultrafine-Grained Cu1.5Cr0.1Si Alloy through ECAP by Route C and Aging Treatment

The evolutions of the microstructure and its effect on the mechanical and electrical conductivity properties of Cu1.5Cr0.1Si alloy after equal channel angle pressing (ECAP)-C path deformation and aging treatment have been investigated using scanning electron microscopy (SEM), x-ray diffraction (XRD)...

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Bibliographic Details
Main Authors: Tingbiao Guo, Xiaoyang Tai, Shiru Wei, Junjie Wang, Zhi Jia, Yutian Ding
Format: Article
Language:English
Published: MDPI AG 2020-03-01
Series:Crystals
Subjects:
Online Access:https://www.mdpi.com/2073-4352/10/3/207