Stiffness maximization for thermal deformation under thermal conductivity constraint using topology optimization
Cooling structures require sufficient thermal conductivity. However, structure with thermal conducting could suffer high temperature, and thermal deformation could become serious. Thus, designing structures suppressing thermal deformation is an important task for designing cooling structures. Struct...
| Main Authors: | , , |
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| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2015-07-01
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| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/81/828/81_15-00111/_pdf/-char/en |