Development of high strength W/V/Au/ODS-Cu joint using HIP process
A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2016-12-01
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| Series: | Nuclear Materials and Energy |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2352179115300715 |