Development of high strength W/V/Au/ODS-Cu joint using HIP process
A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Elsevier
2016-12-01
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| Series: | Nuclear Materials and Energy |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2352179115300715 |
| _version_ | 1819265199577759744 |
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| author | Hiroyuki Noto Tetsuya Yamada Yoshimitsu Hishinuma Takeo Muroga |
| author_facet | Hiroyuki Noto Tetsuya Yamada Yoshimitsu Hishinuma Takeo Muroga |
| author_sort | Hiroyuki Noto |
| collection | DOAJ |
| description | A new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu. |
| first_indexed | 2024-12-23T20:41:35Z |
| format | Article |
| id | doaj.art-bcbc136821ca4ec78fff0b9190522c8c |
| institution | Directory Open Access Journal |
| issn | 2352-1791 |
| language | English |
| last_indexed | 2024-12-23T20:41:35Z |
| publishDate | 2016-12-01 |
| publisher | Elsevier |
| record_format | Article |
| series | Nuclear Materials and Energy |
| spelling | doaj.art-bcbc136821ca4ec78fff0b9190522c8c2022-12-21T17:31:54ZengElsevierNuclear Materials and Energy2352-17912016-12-019C41141510.1016/j.nme.2016.05.013Development of high strength W/V/Au/ODS-Cu joint using HIP processHiroyuki Noto0Tetsuya Yamada1Yoshimitsu Hishinuma2Takeo Muroga3National Institute for Fusion Science,Oroshi 322-6, Toki, 509-5292, JapanNagoya University, Nagoya, 464-8601, JapanNational Institute for Fusion Science,Oroshi 322-6, Toki, 509-5292, JapanNational Institute for Fusion Science,Oroshi 322-6, Toki, 509-5292, JapanA new high strength bonding method between Tungsten (W) and Oxide Dispersion Strengthening copper (ODS-Cu) using vanadium (V) and gold (Au) inserts was investigated and the resulting joints were characterized with SEM, micro-hardness and four point bending test. For the joints using thick Au inserts (300µm), a hardened reaction layer was observed in the V/Au interface region. On the other hand, the joints using thin Au inserts (0.7µm) exhibited a serrated interface layer having homogeneous hardness profiles. In this case, the observed behavior is a reflection of degradation of melting point by inter-diffusion between Au and Cu. Room temperature bending test of the joints with and without 0.7µm inserts at interface between V and ODS-Cu exhibited yielding behavior with the strength of approximately 300MPa which is close to that of ODS-Cu. The joint with the thin Au insert had a serrated interface which implies appearance of liquid phase by reaction between Au and Cu.http://www.sciencedirect.com/science/article/pii/S2352179115300715TungstenPlasma facing materialsCopperBondingVanadium insertGold insert |
| spellingShingle | Hiroyuki Noto Tetsuya Yamada Yoshimitsu Hishinuma Takeo Muroga Development of high strength W/V/Au/ODS-Cu joint using HIP process Nuclear Materials and Energy Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert |
| title | Development of high strength W/V/Au/ODS-Cu joint using HIP process |
| title_full | Development of high strength W/V/Au/ODS-Cu joint using HIP process |
| title_fullStr | Development of high strength W/V/Au/ODS-Cu joint using HIP process |
| title_full_unstemmed | Development of high strength W/V/Au/ODS-Cu joint using HIP process |
| title_short | Development of high strength W/V/Au/ODS-Cu joint using HIP process |
| title_sort | development of high strength w v au ods cu joint using hip process |
| topic | Tungsten Plasma facing materials Copper Bonding Vanadium insert Gold insert |
| url | http://www.sciencedirect.com/science/article/pii/S2352179115300715 |
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