Methodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIM

Methodology for Improving Scanning Performance Loading an Array Element with a 3D All-Metal WAIM

All-metal 3D printing technologies are allowing the conception of new structures for different applications. This publication explores the potential of employing for the first time an all-metal 3D unit-cell topology to perform wide-angle impedance matching layers. A new equivalent circuit is derived...

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Bibliographic Details
Main Authors: Diego Bermúdez-Martín, Raphaël Gillard, Carlos Molero, Hervé Legay, María García-Vigueras
Format: Article
Language:English
Published: MDPI AG 2022-09-01
Series:Electronics
Subjects:
equivalent circuit
improving scanning
TEM waveguide unit-cell
3D all-metal
Online Access:https://www.mdpi.com/2079-9292/11/18/2848

Internet

https://www.mdpi.com/2079-9292/11/18/2848

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