Bin2Vec: A Better Wafer Bin Map Coloring Scheme for Comprehensible Visualization and Effective Bad Wafer Classification
A wafer bin map (WBM), which is the result of an electrical die-sorting test, provides information on which bins failed what tests, and plays an important role in finding defective wafer patterns in semiconductor manufacturing. Current wafer inspection based on WBM has two problems: good/bad WBM cla...
| Main Authors: | , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-02-01
|
| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/9/3/597 |