Editorial for the Special Issue “MEMS Packaging Technologies and 3D Integration”
As fabrication technologies advance, the packaging of MEMS device is being developed in two main directions: MEMS device packaging and MEMS or sensor system integration [...]
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-05-01
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| Series: | Micromachines |
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| Online Access: | https://www.mdpi.com/2072-666X/13/5/749 |