Optimization method of cutting parameters of wafer dicing saw based on orthogonal regression design
Abstract Wafer dicing saw is one of the core equipment in the manufacturing process of semiconductor integrated circuit components. The cutting accuracy of dicing saw directly affects the overall quality of processed chips. This paper systematically investigates the relationship between the main cut...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Springer
2022-09-01
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| Series: | SN Applied Sciences |
| Subjects: | |
| Online Access: | https://doi.org/10.1007/s42452-022-05146-1 |