Effect of Grain Structure on the Failure Mechanism of Cu/Cu3Sn Investigated Via Molecular Dynamic Simulations
The grain structure has a great influence on the mechanical reliability of miniaturized interconnect circuits. Under the working conditions, Cu3Sn will be the main intermetallic compound that forms during electromigration and the thermal ageing process, which can easily induce cracks between Cu3Sn a...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Frontiers Media S.A.
2022-03-01
|
| Series: | Frontiers in Materials |
| Subjects: | |
| Online Access: | https://www.frontiersin.org/articles/10.3389/fmats.2022.860708/full |