Analysis and optimization of a novel high cooling flux stacked T-shaped thermoelectric cooler
To meet the cooling demands of high heat flow density hotspots in scenarios such as electronic chips, a novel three-dimensional stacked T-shaped thermoelectric cooler (STTEC) is designed in this study. Under steady-state conditions, a finite element method with coupled thermal–electrical–mechanical...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2023-11-01
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| Series: | AIP Advances |
| Online Access: | http://dx.doi.org/10.1063/5.0174135 |