Cu/Al Clad and Ag-4Pd Ribbon Bonding for High Power IC Packages
Ultrasonic Wire bonding is widely applied in the electronics industry, especially in the field of power integrated circuits (Power IC). In the present work, the bonding interface of Cu/Al clad and Ag-4Pd alloy 100 ===?===m ultra-thin ribbons bonded on different DBC substrates metallized with Ni, Au...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IFSA Publishing, S.L.
2019-07-01
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| Series: | Sensors & Transducers |
| Subjects: | |
| Online Access: | https://sensorsportal.com/HTML/DIGEST/july_2019/Vol_235/P_3097.pdf |