A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material

A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material

Electrochemical migration (ECM) of sintered nano-Ag could be a serious reliability concern for power devices with high-density packaging. An anti-ECM nano-Ag-SiO<sub>x</sub> paste was proposed by doping 0.1wt% SiO<sub>x</sub> nanoparticles rather than previously used expensiv...

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Bibliographic Details
Main Authors: Zikun Ding, Zhichao Wang, Bowen Zhang, Guo-Quan Lu, Yun-Hui Mei
Format: Article
Language:English
Published: MDPI AG 2022-05-01
Series:Applied Sciences
Subjects:
electrochemical migration
ionic migration
sintering
nanosilver
doping
Ag nanoparticles
Online Access:https://www.mdpi.com/2076-3417/12/9/4748

Internet

https://www.mdpi.com/2076-3417/12/9/4748

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