Injection Compression Molding of LDS-MID for Millimeter Wave Applications
LDS-MIDs (laser direct structured mechatronic integrated devices) are 3D (three-dimensional) circuit carriers that are used in many applications with a focus on antennas. However, thanks to the rising frequencies of HF (high-frequency) systems in 5G and radar applications up to the mmWave (millimete...
| Hoofdauteurs: | , , , , |
|---|---|
| Formaat: | Artikel |
| Taal: | English |
| Gepubliceerd in: |
MDPI AG
2023-10-01
|
| Reeks: | Journal of Manufacturing and Materials Processing |
| Onderwerpen: | |
| Online toegang: | https://www.mdpi.com/2504-4494/7/5/184 |