Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices

Low Temperature Cu/Ga Solid–Liquid Inter-Diffusion Bonding Used for Interfacial Heat Transfer in High-Power Devices

Interfacial heat transfer is essential for the development of high-power devices with high heat flux. The metallurgical bonding of Cu substrates is successfully realized by using a self-made interlayer at 10 °C, without any flux, by Cu/Ga solid-liquid inter-diffusion bonding (SLID), which can be use...

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Bibliographic Details
Main Authors: Guoqian Mu, Wenqing Qu, Haiyun Zhu, Hongshou Zhuang, Yanhua Zhang
Format: Article
Language:English
Published: MDPI AG 2020-09-01
Series:Metals
Subjects:
heat dissipation
interfacial heat transfer
SLID
Cu/Ga
low temperature bonding
thermal interface material (TIM)
Online Access:https://www.mdpi.com/2075-4701/10/9/1223

Internet

https://www.mdpi.com/2075-4701/10/9/1223

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