Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

Study of Wettability and Solderability of SiC Ceramics with Ni by Use of Sn-Sb-Ti Solder by Heating with Electron Beam in Vacuum

The aim of this research was to study the wettability and solderability of SiC ceramics by the use of an active solder of the type Sn5Sb3Ti in a vacuum by electron beam heating. This solder exerts a narrow melting interval, and only one thermal effect, a peritectic reaction, was observed. The liquid...

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Bibliographic Details
Main Authors: Roman Kolenak, Igor Kostolny, Jaromir Drapala, Jan Urminsky, Alexej Pluhar, Paulina Babincova, Daniel Drimal
Format: Article
Language:English
Published: MDPI AG 2022-08-01
Series:Materials
Subjects:
active solder
solderability
wettability
electron beam
SiC ceramics
Online Access:https://www.mdpi.com/1996-1944/15/15/5301

Internet

https://www.mdpi.com/1996-1944/15/15/5301

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