High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate Dielectric

Abstract Solution‐processed microelectronics offer advantages, including cost‐effectiveness, higher energy efficiency, and compatibility with rapid prototyping compared to their counterparts fabricated through traditional semiconductor manufacturing processes. Unfortunately, solution‐processed trans...

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Main Authors: Yutong Liu, Yang Yu, Tianzhi Li, Yihong Hu, Ranjith Unnithan, Efstratios Skafidas
Format: Article
Language:English
Published: Wiley-VCH 2023-11-01
Series:Advanced Electronic Materials
Subjects:
Online Access:https://doi.org/10.1002/aelm.202300415
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author Yutong Liu
Yang Yu
Tianzhi Li
Yihong Hu
Ranjith Unnithan
Efstratios Skafidas
author_facet Yutong Liu
Yang Yu
Tianzhi Li
Yihong Hu
Ranjith Unnithan
Efstratios Skafidas
author_sort Yutong Liu
collection DOAJ
description Abstract Solution‐processed microelectronics offer advantages, including cost‐effectiveness, higher energy efficiency, and compatibility with rapid prototyping compared to their counterparts fabricated through traditional semiconductor manufacturing processes. Unfortunately, solution‐processed transistors exhibit wide performance variability and low yield. In this work, a solution‐processed transparent indium gallium zinc oxide (IGZO) thin film transistor with a low temperature‐annealed hafnium oxide dielectric layer is described. Post‐annealing temperatures for the sol–gel hafnium dioxide thin film are reduced to below 200 °C, significantly expanding the range of substrates on which the metal oxide dielectric can be deposited. The fabricated devices exhibit excellent characteristics with high field‐effect mobilities of over 85 cm2 V−1 s−1, along with low subthreshold swing below 140 mV dec−1, high on/off ratios, and near‐zero threshold voltages when operating stably at low‐operating voltages of 2 V. The solution processed transparent hafnium dioxide gate dielectric IGZO transistors are shown to exhibit comparatively significantly lower device variation and high yield, allowing for the reproducible fabrication of large‐area and transparent solution processed microelectronics systems.
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spelling doaj.art-c1877419f5fa49859e6da2b3748acc972023-11-10T08:29:50ZengWiley-VCHAdvanced Electronic Materials2199-160X2023-11-01911n/an/a10.1002/aelm.202300415High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate DielectricYutong Liu0Yang Yu1Tianzhi Li2Yihong Hu3Ranjith Unnithan4Efstratios Skafidas5Department of Electrical and Electronic Engineering Faculty of Engineering and Information Technology The University of Melbourne Parkville VIC 3010 AustraliaDepartment of Electrical and Electronic Engineering Faculty of Engineering and Information Technology The University of Melbourne Parkville VIC 3010 AustraliaDepartment of Electrical and Electronic Engineering Faculty of Engineering and Information Technology The University of Melbourne Parkville VIC 3010 AustraliaSchool of Engineering RMIT University Melbourne VIC 3000 AustraliaDepartment of Electrical and Electronic Engineering Faculty of Engineering and Information Technology The University of Melbourne Parkville VIC 3010 AustraliaDepartment of Electrical and Electronic Engineering Faculty of Engineering and Information Technology The University of Melbourne Parkville VIC 3010 AustraliaAbstract Solution‐processed microelectronics offer advantages, including cost‐effectiveness, higher energy efficiency, and compatibility with rapid prototyping compared to their counterparts fabricated through traditional semiconductor manufacturing processes. Unfortunately, solution‐processed transistors exhibit wide performance variability and low yield. In this work, a solution‐processed transparent indium gallium zinc oxide (IGZO) thin film transistor with a low temperature‐annealed hafnium oxide dielectric layer is described. Post‐annealing temperatures for the sol–gel hafnium dioxide thin film are reduced to below 200 °C, significantly expanding the range of substrates on which the metal oxide dielectric can be deposited. The fabricated devices exhibit excellent characteristics with high field‐effect mobilities of over 85 cm2 V−1 s−1, along with low subthreshold swing below 140 mV dec−1, high on/off ratios, and near‐zero threshold voltages when operating stably at low‐operating voltages of 2 V. The solution processed transparent hafnium dioxide gate dielectric IGZO transistors are shown to exhibit comparatively significantly lower device variation and high yield, allowing for the reproducible fabrication of large‐area and transparent solution processed microelectronics systems.https://doi.org/10.1002/aelm.202300415dielectricslow‐temperature solution processessemiconductorsthin film transistors
spellingShingle Yutong Liu
Yang Yu
Tianzhi Li
Yihong Hu
Ranjith Unnithan
Efstratios Skafidas
High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate Dielectric
Advanced Electronic Materials
dielectrics
low‐temperature solution processes
semiconductors
thin film transistors
title High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate Dielectric
title_full High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate Dielectric
title_fullStr High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate Dielectric
title_full_unstemmed High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate Dielectric
title_short High Performance and High Yield Solution Processed IGZO Thin Film Transistors Fabricated with Low‐Temperature Annealed Hafnium Dioxide Gate Dielectric
title_sort high performance and high yield solution processed igzo thin film transistors fabricated with low temperature annealed hafnium dioxide gate dielectric
topic dielectrics
low‐temperature solution processes
semiconductors
thin film transistors
url https://doi.org/10.1002/aelm.202300415
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