The Road to a Robust and Affordable SiC Power MOSFET Technology

This article provides a detailed study of performance and reliability issues and trade-offs in silicon carbide (SiC) power MOSFETs. The reliability issues such as threshold voltage variation across devices from the same vendor, instability of threshold voltage under positive and negative gate bias,...

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Main Authors: Hema Lata Rao Maddi, Susanna Yu, Shengnan Zhu, Tianshi Liu, Limeng Shi, Minseok Kang, Diang Xing, Suvendu Nayak, Marvin H. White, Anant K. Agarwal
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Energies
Subjects:
Online Access:https://www.mdpi.com/1996-1073/14/24/8283
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author Hema Lata Rao Maddi
Susanna Yu
Shengnan Zhu
Tianshi Liu
Limeng Shi
Minseok Kang
Diang Xing
Suvendu Nayak
Marvin H. White
Anant K. Agarwal
author_facet Hema Lata Rao Maddi
Susanna Yu
Shengnan Zhu
Tianshi Liu
Limeng Shi
Minseok Kang
Diang Xing
Suvendu Nayak
Marvin H. White
Anant K. Agarwal
author_sort Hema Lata Rao Maddi
collection DOAJ
description This article provides a detailed study of performance and reliability issues and trade-offs in silicon carbide (SiC) power MOSFETs. The reliability issues such as threshold voltage variation across devices from the same vendor, instability of threshold voltage under positive and negative gate bias, long-term reliability of gate oxide, screening of devices with extrinsic defects by means of gate voltage, body diode degradation, and short circuit withstand time are investigated through testing of commercial devices from different vendors and two-dimensional simulations. Price roadmap and foundry models of SiC MOSFETs are discussed. Future development of mixed-mode CMOS circuits with high voltage lateral MOSFETs along with 4−6× higher power handling capability compared to silicon circuits has been described.
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spelling doaj.art-c2cedf7acf394cbab0e81e339e2b9d892023-11-23T08:05:06ZengMDPI AGEnergies1996-10732021-12-011424828310.3390/en14248283The Road to a Robust and Affordable SiC Power MOSFET TechnologyHema Lata Rao Maddi0Susanna Yu1Shengnan Zhu2Tianshi Liu3Limeng Shi4Minseok Kang5Diang Xing6Suvendu Nayak7Marvin H. White8Anant K. Agarwal9Department of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USADepartment of Electrical Engineering, Indian Institute of Technology Bombay, Mumbai 400076, IndiaDepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USADepartment of Electrical and Computer Engineering, The Ohio State University, Columbus, OH 43210, USAThis article provides a detailed study of performance and reliability issues and trade-offs in silicon carbide (SiC) power MOSFETs. The reliability issues such as threshold voltage variation across devices from the same vendor, instability of threshold voltage under positive and negative gate bias, long-term reliability of gate oxide, screening of devices with extrinsic defects by means of gate voltage, body diode degradation, and short circuit withstand time are investigated through testing of commercial devices from different vendors and two-dimensional simulations. Price roadmap and foundry models of SiC MOSFETs are discussed. Future development of mixed-mode CMOS circuits with high voltage lateral MOSFETs along with 4−6× higher power handling capability compared to silicon circuits has been described.https://www.mdpi.com/1996-1073/14/24/8283SiC MOSFETthreshold voltageoxide reliabilitybody diodeshort circuit withstand time
spellingShingle Hema Lata Rao Maddi
Susanna Yu
Shengnan Zhu
Tianshi Liu
Limeng Shi
Minseok Kang
Diang Xing
Suvendu Nayak
Marvin H. White
Anant K. Agarwal
The Road to a Robust and Affordable SiC Power MOSFET Technology
Energies
SiC MOSFET
threshold voltage
oxide reliability
body diode
short circuit withstand time
title The Road to a Robust and Affordable SiC Power MOSFET Technology
title_full The Road to a Robust and Affordable SiC Power MOSFET Technology
title_fullStr The Road to a Robust and Affordable SiC Power MOSFET Technology
title_full_unstemmed The Road to a Robust and Affordable SiC Power MOSFET Technology
title_short The Road to a Robust and Affordable SiC Power MOSFET Technology
title_sort road to a robust and affordable sic power mosfet technology
topic SiC MOSFET
threshold voltage
oxide reliability
body diode
short circuit withstand time
url https://www.mdpi.com/1996-1073/14/24/8283
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