A Multichannel, High-Bandwidth Wirelane Receiver for D2D Interconnects

A Multichannel, High-Bandwidth Wirelane Receiver for D2D Interconnects

This paper proposes a multichannel and high-bandwidth (BW) receiver for standard packaging die-to-die (D2D) interconnects. The receiver adopts forward clock (FCK) architecture of the high-density transmission standard, which consists of 16 high-speed data paths and a pair of low-speed differential c...

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Bibliographic Details
Main Authors: Geng Zhang, Mingche Lai, Fangxu Lyu
Format: Article
Language:English
Published: MDPI AG 2022-09-01
Series:Electronics
Subjects:
die-to-die
phase interpolator
forward clock
jitter performance
bit error rate
Online Access:https://www.mdpi.com/2079-9292/11/18/2864

Internet

https://www.mdpi.com/2079-9292/11/18/2864

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