Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging

Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging

The evolution of the transient liquid-phase sintered (TLPS) Cu–Sn skeleton microstructure during thermal aging was evaluated to clarify the thermal reliability for die-attach applications. The Cu–Sn skeleton microstructure, which consists of Cu particles connected with Cu&nda...

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Bibliographic Details
Main Authors: Hiroaki Tatsumi, Adrian Lis, Hiroshi Yamaguchi, Tomoki Matsuda, Tomokazu Sano, Yoshihiro Kashiba, Akio Hirose
Format: Article
Language:English
Published: MDPI AG 2019-01-01
Series:Applied Sciences
Subjects:
transient liquid-phase sintering (TLPS)
composite
microstructural evolution
intermetallic compounds
thermal reliability
die attach
Online Access:http://www.mdpi.com/2076-3417/9/1/157

Internet

http://www.mdpi.com/2076-3417/9/1/157

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