Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging
The evolution of the transient liquid-phase sintered (TLPS) Cu–Sn skeleton microstructure during thermal aging was evaluated to clarify the thermal reliability for die-attach applications. The Cu–Sn skeleton microstructure, which consists of Cu particles connected with Cu&nda...
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MDPI AG
2019-01-01
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| Series: | Applied Sciences |
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| Online Access: | http://www.mdpi.com/2076-3417/9/1/157 |
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| author | Hiroaki Tatsumi Adrian Lis Hiroshi Yamaguchi Tomoki Matsuda Tomokazu Sano Yoshihiro Kashiba Akio Hirose |
| author_facet | Hiroaki Tatsumi Adrian Lis Hiroshi Yamaguchi Tomoki Matsuda Tomokazu Sano Yoshihiro Kashiba Akio Hirose |
| author_sort | Hiroaki Tatsumi |
| collection | DOAJ |
| description | The evolution of the transient liquid-phase sintered (TLPS) Cu–Sn skeleton microstructure during thermal aging was evaluated to clarify the thermal reliability for die-attach applications. The Cu–Sn skeleton microstructure, which consists of Cu particles connected with Cu–Sn intermetallic compounds partially filled with polyimide resin, was obtained by the pressure-less TLP sintering process at 250 °C for 1 min using a novel Cu-solder-resin composite as a bonding material in a nitrogen atmosphere. Experimental results indicate that the TLPS joints were mainly composed of Cu, Cu6Sn5, and Cu3Sn in the as-bonded state, where submicron voids were observed at the interface between Cu3Sn and Cu particles. After thermal aging at 150, 175, and 200 °C for 1000 h, the Cu6Sn5 phase fully transformed into Cu3Sn except at the chip-side interface, where the number of the submicron voids appeared to increase. The averaged shear strengths were found to be 22.1 (reference), 22.8 (+3%), 24.0 (+9%), and 19.0 MPa (−14%) for the as-bonded state and specimens aged at 150, 175, and 200 °C for 1000 h, respectively. The TLPS joints maintained a shear strength over 19 MPa after thermal aging at 200 °C for 1000 h because of both the positive and negative impacts of the thermal aging, which include the transformation of Cu6Sn5 into Cu3Sn and the formation of submicron voids at the interface, respectively. These results indicate an excellent thermal reliability of the TLPS Cu–Sn skeleton microstructure. |
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| institution | Directory Open Access Journal |
| issn | 2076-3417 |
| language | English |
| last_indexed | 2024-04-13T18:10:37Z |
| publishDate | 2019-01-01 |
| publisher | MDPI AG |
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| series | Applied Sciences |
| spelling | doaj.art-c31edac4193340be9e3644d62b9323b02022-12-22T02:35:55ZengMDPI AGApplied Sciences2076-34172019-01-019115710.3390/app9010157app9010157Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal AgingHiroaki Tatsumi0Adrian Lis1Hiroshi Yamaguchi2Tomoki Matsuda3Tomokazu Sano4Yoshihiro Kashiba5Akio Hirose6Manufacturing Engineering Center, Mitsubishi Electric Corporation, Hyogo 6618661, JapanDivision of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, Osaka 5650871, JapanManufacturing Engineering Center, Mitsubishi Electric Corporation, Hyogo 6618661, JapanDivision of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, Osaka 5650871, JapanDivision of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, Osaka 5650871, JapanDivision of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, Osaka 5650871, JapanDivision of Materials and Manufacturing Science, Graduate School of Engineering, Osaka University, Osaka 5650871, JapanThe evolution of the transient liquid-phase sintered (TLPS) Cu–Sn skeleton microstructure during thermal aging was evaluated to clarify the thermal reliability for die-attach applications. The Cu–Sn skeleton microstructure, which consists of Cu particles connected with Cu–Sn intermetallic compounds partially filled with polyimide resin, was obtained by the pressure-less TLP sintering process at 250 °C for 1 min using a novel Cu-solder-resin composite as a bonding material in a nitrogen atmosphere. Experimental results indicate that the TLPS joints were mainly composed of Cu, Cu6Sn5, and Cu3Sn in the as-bonded state, where submicron voids were observed at the interface between Cu3Sn and Cu particles. After thermal aging at 150, 175, and 200 °C for 1000 h, the Cu6Sn5 phase fully transformed into Cu3Sn except at the chip-side interface, where the number of the submicron voids appeared to increase. The averaged shear strengths were found to be 22.1 (reference), 22.8 (+3%), 24.0 (+9%), and 19.0 MPa (−14%) for the as-bonded state and specimens aged at 150, 175, and 200 °C for 1000 h, respectively. The TLPS joints maintained a shear strength over 19 MPa after thermal aging at 200 °C for 1000 h because of both the positive and negative impacts of the thermal aging, which include the transformation of Cu6Sn5 into Cu3Sn and the formation of submicron voids at the interface, respectively. These results indicate an excellent thermal reliability of the TLPS Cu–Sn skeleton microstructure.http://www.mdpi.com/2076-3417/9/1/157transient liquid-phase sintering (TLPS)compositemicrostructural evolutionintermetallic compoundsthermal reliabilitydie attach |
| spellingShingle | Hiroaki Tatsumi Adrian Lis Hiroshi Yamaguchi Tomoki Matsuda Tomokazu Sano Yoshihiro Kashiba Akio Hirose Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging Applied Sciences transient liquid-phase sintering (TLPS) composite microstructural evolution intermetallic compounds thermal reliability die attach |
| title | Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging |
| title_full | Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging |
| title_fullStr | Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging |
| title_full_unstemmed | Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging |
| title_short | Evolution of Transient Liquid-Phase Sintered Cu–Sn Skeleton Microstructure During Thermal Aging |
| title_sort | evolution of transient liquid phase sintered cu sn skeleton microstructure during thermal aging |
| topic | transient liquid-phase sintering (TLPS) composite microstructural evolution intermetallic compounds thermal reliability die attach |
| url | http://www.mdpi.com/2076-3417/9/1/157 |
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