Influence of carbon nanotubes on the morphology of Cu6Sn5 in Cu/(Sn–Ag–Cu) solder joints

Influence of carbon nanotubes on the morphology of Cu6Sn5 in Cu/(Sn–Ag–Cu) solder joints

This study delves into the intricate interaction between multi-walled carbon nanotubes (MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free soldering applications. Reflow and isothermal aging induce the formation of intermetallic layers at the joint interface, including C...

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Bibliographic Details
Main Authors: Minho Oh, Hiroka Iwamoto, Equo Kobayashi
Format: Article
Language:English
Published: Elsevier 2024-03-01
Series:Results in Materials
Subjects:
Carbon nanotubes
Intermetallic compound
Sn–Ag–Cu alloys
Rate-controlling process
Cu6Sn5 morphology
Grain boundary diffusion
Online Access:http://www.sciencedirect.com/science/article/pii/S2590048X2400027X

Internet

http://www.sciencedirect.com/science/article/pii/S2590048X2400027X

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