Prediction of delamination strength at interface between thin film and substrate by cohesive zone model
An electronic device consists of multi-layered submicron-thick films, and delamination often takes place at an interface edge because of the stress singularity near the edge. Since the stress singularity at an interface edge depends on the edge shape, the fracture mechanics concept cannot be used to...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Publishing House for Science and Technology
2006-12-01
|
| Series: | Vietnam Journal of Mechanics |
| Online Access: | https://vjs.ac.vn/index.php/vjmech/article/view/5585 |