TSV‐based common‐mode noise‐suppressing filter design and implementation
Abstract A through‐silicon via (TSV)‐based, common‐mode, noise‐suppressing filter (TSV‐CMF) with the silicon interposer process is proposed to improve the electromagnetic compatibility in 3D integrated circuits. A differential fifth‐order T‐model low‐pass filter prototype circuit for transmission li...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2022-03-01
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| Series: | Electronics Letters |
| Online Access: | https://doi.org/10.1049/ell2.12412 |