TSV‐based common‐mode noise‐suppressing filter design and implementation
Abstract A through‐silicon via (TSV)‐based, common‐mode, noise‐suppressing filter (TSV‐CMF) with the silicon interposer process is proposed to improve the electromagnetic compatibility in 3D integrated circuits. A differential fifth‐order T‐model low‐pass filter prototype circuit for transmission li...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2022-03-01
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| Series: | Electronics Letters |
| Online Access: | https://doi.org/10.1049/ell2.12412 |
| _version_ | 1828405900981829632 |
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| author | Zhensong Li Huan Liu Yunheng Sun Yang Yang Min Miao Shenglin Ma Yufeng Jin |
| author_facet | Zhensong Li Huan Liu Yunheng Sun Yang Yang Min Miao Shenglin Ma Yufeng Jin |
| author_sort | Zhensong Li |
| collection | DOAJ |
| description | Abstract A through‐silicon via (TSV)‐based, common‐mode, noise‐suppressing filter (TSV‐CMF) with the silicon interposer process is proposed to improve the electromagnetic compatibility in 3D integrated circuits. A differential fifth‐order T‐model low‐pass filter prototype circuit for transmission lines with common inductance is used to characterize and design the stopband and the corresponding two transmission zeros for the common mode (CM). The circuit parameters are carefully designed and calculated to fit the performance requirement. The TSV‐CMF is implemented in an interposer process with TSV as the vertical connect and redistribution layer (RDL) as the capacitance and inductance. TSV‐CMF samples are tested, and the measurement results match those of the full‐wave simulation. The differential cut‐off frequency of the TSV‐CMF can reach 16 GHz, and the CM stopband is around 5.3–16.0 GHz with 100% fractional bandwidth. |
| first_indexed | 2024-12-10T11:02:47Z |
| format | Article |
| id | doaj.art-c43ddbc1072a4b3888a389a9d4a76f04 |
| institution | Directory Open Access Journal |
| issn | 0013-5194 1350-911X |
| language | English |
| last_indexed | 2024-12-10T11:02:47Z |
| publishDate | 2022-03-01 |
| publisher | Wiley |
| record_format | Article |
| series | Electronics Letters |
| spelling | doaj.art-c43ddbc1072a4b3888a389a9d4a76f042022-12-22T01:51:39ZengWileyElectronics Letters0013-51941350-911X2022-03-0158624324510.1049/ell2.12412TSV‐based common‐mode noise‐suppressing filter design and implementationZhensong Li0Huan Liu1Yunheng Sun2Yang Yang3Min Miao4Shenglin Ma5Yufeng Jin6Academy of Smart IC and Networks Key Laboratory of the Ministry of Education for Optoelectronic Measurement Technology and Instrument Beijing Information Science and Technology University Beijing ChinaBeijing Institute of Radio Measurement Beijing ChinaShanghai Institute of Satellite Engineering Shanghai ChinaShenzhen Graduate School of Peking University Shenzhen ChinaAcademy of Smart IC and Networks Key Laboratory of the Ministry of Education for Optoelectronic Measurement Technology and Instrument Beijing Information Science and Technology University Beijing ChinaDepartment of Mechanical and Electrical Engineering Xiamen University Xiamen ChinaInstitute of Microelectronics Peking University Beijing ChinaAbstract A through‐silicon via (TSV)‐based, common‐mode, noise‐suppressing filter (TSV‐CMF) with the silicon interposer process is proposed to improve the electromagnetic compatibility in 3D integrated circuits. A differential fifth‐order T‐model low‐pass filter prototype circuit for transmission lines with common inductance is used to characterize and design the stopband and the corresponding two transmission zeros for the common mode (CM). The circuit parameters are carefully designed and calculated to fit the performance requirement. The TSV‐CMF is implemented in an interposer process with TSV as the vertical connect and redistribution layer (RDL) as the capacitance and inductance. TSV‐CMF samples are tested, and the measurement results match those of the full‐wave simulation. The differential cut‐off frequency of the TSV‐CMF can reach 16 GHz, and the CM stopband is around 5.3–16.0 GHz with 100% fractional bandwidth.https://doi.org/10.1049/ell2.12412 |
| spellingShingle | Zhensong Li Huan Liu Yunheng Sun Yang Yang Min Miao Shenglin Ma Yufeng Jin TSV‐based common‐mode noise‐suppressing filter design and implementation Electronics Letters |
| title | TSV‐based common‐mode noise‐suppressing filter design and implementation |
| title_full | TSV‐based common‐mode noise‐suppressing filter design and implementation |
| title_fullStr | TSV‐based common‐mode noise‐suppressing filter design and implementation |
| title_full_unstemmed | TSV‐based common‐mode noise‐suppressing filter design and implementation |
| title_short | TSV‐based common‐mode noise‐suppressing filter design and implementation |
| title_sort | tsv based common mode noise suppressing filter design and implementation |
| url | https://doi.org/10.1049/ell2.12412 |
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