Low-temperature crosslinked soluble polyimide as a dielectric for organic thin-film transistors: enhanced electrical stability and performance

Low-temperature crosslinked soluble polyimide as a dielectric for organic thin-film transistors: enhanced electrical stability and performance

We have prepared a low-temperature cross-linked soluble polyimide (SPI) as a dielectric material for organic thin-film transistors (OTFTs) to improve their electrical stability. Two types of SPIs (DOCDA/6FHAB and 6FDA/6FHAB) were synthesized by a one-step polymerization process using 5-(2,5-dioxytet...

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Bibliographic Details
Main Authors: Sungmi Yoo, Kyeongmin Kim, Cho Long Kim, Seong Hun Choi, Jong Chan Won, Taek Ahn, Yun Ho Kim
Format: Article
Language:English
Published: IOP Publishing 2024-01-01
Series:JPhys Materials
Subjects:
polymer dielectric
polyimide
cross-linking network
mobility
thin-film transistors
Online Access:https://doi.org/10.1088/2515-7639/ad1ea0

Internet

https://doi.org/10.1088/2515-7639/ad1ea0

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