UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability

UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability

As metasurfaces begin to find industrial applications there is a need to develop scalable and cost-effective fabrication techniques which offer sub-100 nm resolution while providing high throughput and large area patterning. Here we demonstrate the use of UV-Nanoimprint Lithography and Deep Reactive...

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Bibliographic Details
Main Authors: Christopher A. Dirdal, Karolina Milenko, Anand Summanwar, Firehun T. Dullo, Paul C. V. Thrane, Oana Rasoga, Andrei M. Avram, Adrian Dinescu, Angela M. Baracu
Format: Article
Language:English
Published: MDPI AG 2023-01-01
Series:Nanomaterials
Subjects:
metasurfaces
photonic sensors
nanopatterning
Online Access:https://www.mdpi.com/2079-4991/13/3/436

Internet

https://www.mdpi.com/2079-4991/13/3/436

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