UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability
As metasurfaces begin to find industrial applications there is a need to develop scalable and cost-effective fabrication techniques which offer sub-100 nm resolution while providing high throughput and large area patterning. Here we demonstrate the use of UV-Nanoimprint Lithography and Deep Reactive...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2023-01-01
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| Series: | Nanomaterials |
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| Online Access: | https://www.mdpi.com/2079-4991/13/3/436 |
| _version_ | 1797623638614081536 |
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| author | Christopher A. Dirdal Karolina Milenko Anand Summanwar Firehun T. Dullo Paul C. V. Thrane Oana Rasoga Andrei M. Avram Adrian Dinescu Angela M. Baracu |
| author_facet | Christopher A. Dirdal Karolina Milenko Anand Summanwar Firehun T. Dullo Paul C. V. Thrane Oana Rasoga Andrei M. Avram Adrian Dinescu Angela M. Baracu |
| author_sort | Christopher A. Dirdal |
| collection | DOAJ |
| description | As metasurfaces begin to find industrial applications there is a need to develop scalable and cost-effective fabrication techniques which offer sub-100 nm resolution while providing high throughput and large area patterning. Here we demonstrate the use of UV-Nanoimprint Lithography and Deep Reactive Ion Etching (Bosch and Cryogenic) towards this goal. Robust processes are described for the fabrication of silicon rectangular pillars of high pattern fidelity. To demonstrate the quality of the structures, metasurface lenses, which demonstrate diffraction limited focusing and close to theoretical efficiency for NIR wavelengths λ ∈ (1.3 μm, 1.6 μm), are fabricated. We demonstrate a process which removes the characteristic sidewall surface roughness of the Bosch process, allowing for smooth 90-degree vertical sidewalls. We also demonstrate that the optical performance of the metasurface lenses is not affected adversely in the case of Bosch sidewall surface roughness with 45 nm indentations (or scallops). Next steps of development are defined for achieving full wafer coverage. |
| first_indexed | 2024-03-11T09:31:44Z |
| format | Article |
| id | doaj.art-c5d8a3e0d15446a89f76f8d089478fba |
| institution | Directory Open Access Journal |
| issn | 2079-4991 |
| language | English |
| last_indexed | 2024-03-11T09:31:44Z |
| publishDate | 2023-01-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Nanomaterials |
| spelling | doaj.art-c5d8a3e0d15446a89f76f8d089478fba2023-11-16T17:34:41ZengMDPI AGNanomaterials2079-49912023-01-0113343610.3390/nano13030436UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and RepeatabilityChristopher A. Dirdal0Karolina Milenko1Anand Summanwar2Firehun T. Dullo3Paul C. V. Thrane4Oana Rasoga5Andrei M. Avram6Adrian Dinescu7Angela M. Baracu8SINTEF Microsystems and Nanotechnology, Gaustadalleen 23C, 0737 Oslo, NorwaySINTEF Microsystems and Nanotechnology, Gaustadalleen 23C, 0737 Oslo, NorwaySINTEF Microsystems and Nanotechnology, Gaustadalleen 23C, 0737 Oslo, NorwaySINTEF Microsystems and Nanotechnology, Gaustadalleen 23C, 0737 Oslo, NorwaySINTEF Microsystems and Nanotechnology, Gaustadalleen 23C, 0737 Oslo, NorwayNational Institute of Materials Physics, Atomistilor Street 405 A, 077125 Magurele, RomaniaNational Institute for Research and Development in Microtechnologies-IMT Bucharest, Erou Iancu Nicolae Street 126A, 077190 Voluntari, RomaniaNational Institute for Research and Development in Microtechnologies-IMT Bucharest, Erou Iancu Nicolae Street 126A, 077190 Voluntari, RomaniaNational Institute for Research and Development in Microtechnologies-IMT Bucharest, Erou Iancu Nicolae Street 126A, 077190 Voluntari, RomaniaAs metasurfaces begin to find industrial applications there is a need to develop scalable and cost-effective fabrication techniques which offer sub-100 nm resolution while providing high throughput and large area patterning. Here we demonstrate the use of UV-Nanoimprint Lithography and Deep Reactive Ion Etching (Bosch and Cryogenic) towards this goal. Robust processes are described for the fabrication of silicon rectangular pillars of high pattern fidelity. To demonstrate the quality of the structures, metasurface lenses, which demonstrate diffraction limited focusing and close to theoretical efficiency for NIR wavelengths λ ∈ (1.3 μm, 1.6 μm), are fabricated. We demonstrate a process which removes the characteristic sidewall surface roughness of the Bosch process, allowing for smooth 90-degree vertical sidewalls. We also demonstrate that the optical performance of the metasurface lenses is not affected adversely in the case of Bosch sidewall surface roughness with 45 nm indentations (or scallops). Next steps of development are defined for achieving full wafer coverage.https://www.mdpi.com/2079-4991/13/3/436metasurfacesphotonic sensorsnanopatterning |
| spellingShingle | Christopher A. Dirdal Karolina Milenko Anand Summanwar Firehun T. Dullo Paul C. V. Thrane Oana Rasoga Andrei M. Avram Adrian Dinescu Angela M. Baracu UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability Nanomaterials metasurfaces photonic sensors nanopatterning |
| title | UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability |
| title_full | UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability |
| title_fullStr | UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability |
| title_full_unstemmed | UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability |
| title_short | UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability |
| title_sort | uv nanoimprint and deep reactive ion etching of high efficiency silicon metalenses high throughput at low cost with excellent resolution and repeatability |
| topic | metasurfaces photonic sensors nanopatterning |
| url | https://www.mdpi.com/2079-4991/13/3/436 |
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