Transient liquid phase bonding using Cu foam and Cu–Sn paste for high-temperature applications
This study presents a new structure for transient liquid phase (TLP) bonding using Cu foam and Cu–Sn paste. Cu foam and Cu–Sn paste with large reaction surface areas were used to reduce the long bonding time, which is a disadvantage of the conventional TLP bonding process. After applying the Cu–Sn p...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-11-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423026339 |