Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields
Micro-structured copper layers are obtained from pulse-reverse electrodeposition on a planar gold electrode that is magnetically patterned by magnetized iron wires underneath. 3D numerical simulations of the electrodeposition based on an adapted reaction kinetics are able to nicely reproduce the mic...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2022-06-01
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| Series: | Magnetochemistry |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2312-7481/8/7/66 |