Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields
Micro-structured copper layers are obtained from pulse-reverse electrodeposition on a planar gold electrode that is magnetically patterned by magnetized iron wires underneath. 3D numerical simulations of the electrodeposition based on an adapted reaction kinetics are able to nicely reproduce the mic...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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MDPI AG
2022-06-01
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| Series: | Magnetochemistry |
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| Online Access: | https://www.mdpi.com/2312-7481/8/7/66 |
| _version_ | 1797445699092086784 |
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| author | Mengyuan Huang Margitta Uhlemann Kerstin Eckert Gerd Mutschke |
| author_facet | Mengyuan Huang Margitta Uhlemann Kerstin Eckert Gerd Mutschke |
| author_sort | Mengyuan Huang |
| collection | DOAJ |
| description | Micro-structured copper layers are obtained from pulse-reverse electrodeposition on a planar gold electrode that is magnetically patterned by magnetized iron wires underneath. 3D numerical simulations of the electrodeposition based on an adapted reaction kinetics are able to nicely reproduce the micro-structure of the deposit layer, despite the height values still remain underestimated. It is shown that the structuring is enabled by the magnetic gradient force, which generates a local flow that supports deposition and hinders dissolution in the regions of high magnetic gradients. The Lorentz force originating from radial magnetic field components near the rim of the electrode causes a circumferential cell flow. The resulting secondary flow, however, is superseded by the local flow driven by the magnetic gradient force in the vicinity of the wires. Finally, the role of solutal buoyancy effects is discussed to better understand the limitations of structured growth in different modes of deposition and cell geometries. |
| first_indexed | 2024-03-09T13:29:35Z |
| format | Article |
| id | doaj.art-c6a65934d14a4ecba86298cad5ee5634 |
| institution | Directory Open Access Journal |
| issn | 2312-7481 |
| language | English |
| last_indexed | 2024-03-09T13:29:35Z |
| publishDate | 2022-06-01 |
| publisher | MDPI AG |
| record_format | Article |
| series | Magnetochemistry |
| spelling | doaj.art-c6a65934d14a4ecba86298cad5ee56342023-11-30T21:19:37ZengMDPI AGMagnetochemistry2312-74812022-06-01876610.3390/magnetochemistry8070066Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient FieldsMengyuan Huang0Margitta Uhlemann1Kerstin Eckert2Gerd Mutschke3Helmholtz-Zentrum Dresden-Rossendorf (HZDR), Institute of Fluid Dynamics, 01328 Dresden, GermanyIFW Dresden, Institute for Metallic Materials, 01069 Dresden, GermanyHelmholtz-Zentrum Dresden-Rossendorf (HZDR), Institute of Fluid Dynamics, 01328 Dresden, GermanyHelmholtz-Zentrum Dresden-Rossendorf (HZDR), Institute of Fluid Dynamics, 01328 Dresden, GermanyMicro-structured copper layers are obtained from pulse-reverse electrodeposition on a planar gold electrode that is magnetically patterned by magnetized iron wires underneath. 3D numerical simulations of the electrodeposition based on an adapted reaction kinetics are able to nicely reproduce the micro-structure of the deposit layer, despite the height values still remain underestimated. It is shown that the structuring is enabled by the magnetic gradient force, which generates a local flow that supports deposition and hinders dissolution in the regions of high magnetic gradients. The Lorentz force originating from radial magnetic field components near the rim of the electrode causes a circumferential cell flow. The resulting secondary flow, however, is superseded by the local flow driven by the magnetic gradient force in the vicinity of the wires. Finally, the role of solutal buoyancy effects is discussed to better understand the limitations of structured growth in different modes of deposition and cell geometries.https://www.mdpi.com/2312-7481/8/7/66magnetoelectrodepositionsurface structuringmagnetic gradient forceLorentz forcepulse reverse plating |
| spellingShingle | Mengyuan Huang Margitta Uhlemann Kerstin Eckert Gerd Mutschke Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields Magnetochemistry magnetoelectrodeposition surface structuring magnetic gradient force Lorentz force pulse reverse plating |
| title | Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields |
| title_full | Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields |
| title_fullStr | Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields |
| title_full_unstemmed | Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields |
| title_short | Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields |
| title_sort | pulse reverse plating of copper micro structures in magnetic gradient fields |
| topic | magnetoelectrodeposition surface structuring magnetic gradient force Lorentz force pulse reverse plating |
| url | https://www.mdpi.com/2312-7481/8/7/66 |
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