Comparison of thermal stresses for exponential and actual temperature gradient along the depth of E-FG plate
This paper describes the comprehensive thermal stress analysis and solution of simply supported functionally graded plates. Here, heat conduction formulation has been analytically simplified to access the exact temperature profile and the plate's thickness. Mathematical manipulation within basi...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-05-01
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| Series: | Journal of King Saud University: Engineering Sciences |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S101836392100043X |