Simulation on the Interfacial Singular Stress-strain Induced Cracking of Microelectronic Chip Under pPower On-off Cycles

Bibliographic Details
Main Author:	X. Huang
Format:	Article
Language:	English
Published:	MIDEM Society - Society for Microelectronics, Electronic Components and Materials 2019-09-01
Series:	Informacije MIDEM
Subjects:	Thermal fatigue microelectronic chip creep singular field crack nucleation
Online Access:	http://www.midem-drustvo.si/Journal%20papers/MIDEM_49(2019)2p69.pdf

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