Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Heterogeneous Wafer Bonding Technology and Thin-Film Transfer Technology-Enabling Platform for the Next Generation Applications beyond 5G

Wafer bonding technology is one of the most effective methods for high-quality thin-film transfer onto different substrates combined with ion implantation processes, laser irradiation, and the removal of the sacrificial layers. In this review, we systematically summarize and introduce applications o...

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Bibliographic Details
Main Authors: Zhihao Ren, Jikai Xu, Xianhao Le, Chengkuo Lee
Format: Article
Language:English
Published: MDPI AG 2021-08-01
Series:Micromachines
Subjects:
heterogeneous integration
wafer bonding
thin-film transfer
System-in-Package (SiP)
sensor
5G
Online Access:https://www.mdpi.com/2072-666X/12/8/946

Internet

https://www.mdpi.com/2072-666X/12/8/946

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