Image Processor Using 3D-DWT as Part of Health Care Management System

Image Processor Using 3D-DWT as Part of Health Care Management System

This paper presents a low power and high speed 3D-DWT (three-dimensional discrete wavelet transform) architecture using stacked silicon dies for image compression of medical images. The interconnections of stacked chips are based on TSV (through silicon via) techniques. Its low power operation is du...

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Bibliographic Details
Main Authors: Kyung-Chang Park, Yun-Ki Hong, Sang-Jin Lee, Yeon-Ho Kim, Younggap You, Tae Won Cho, Kyoung-Rok Cho, Kamran Eshraghian
Format: Article
Language:English
Published: International Institute of Informatics and Cybernetics 2009-10-01
Series:Journal of Systemics, Cybernetics and Informatics
Subjects:
Wavelet
Tsv
Image Compression
3d-Dwt
Stacked Chip
Online Access:http://www.iiisci.org/Journal/CV$/sci/pdfs/XS576UU.pdf

Internet

http://www.iiisci.org/Journal/CV$/sci/pdfs/XS576UU.pdf

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