Image Processor Using 3D-DWT as Part of Health Care Management System
This paper presents a low power and high speed 3D-DWT (three-dimensional discrete wavelet transform) architecture using stacked silicon dies for image compression of medical images. The interconnections of stacked chips are based on TSV (through silicon via) techniques. Its low power operation is du...
| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
International Institute of Informatics and Cybernetics
2009-10-01
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| Series: | Journal of Systemics, Cybernetics and Informatics |
| Subjects: | |
| Online Access: | http://www.iiisci.org/Journal/CV$/sci/pdfs/XS576UU.pdf
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| _version_ | 1819052556923437056 |
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| author | Kyung-Chang Park Yun-Ki Hong Sang-Jin Lee Yeon-Ho Kim Younggap You Tae Won Cho Kyoung-Rok Cho Kamran Eshraghian |
| author_facet | Kyung-Chang Park Yun-Ki Hong Sang-Jin Lee Yeon-Ho Kim Younggap You Tae Won Cho Kyoung-Rok Cho Kamran Eshraghian |
| author_sort | Kyung-Chang Park |
| collection | DOAJ |
| description | This paper presents a low power and high speed 3D-DWT (three-dimensional discrete wavelet transform) architecture using stacked silicon dies for image compression of medical images. The interconnections of stacked chips are based on TSV (through silicon via) techniques. Its low power operation is due to short signal paths between layers. The area of 3D architecture is much smaller than that of 2D counterpart having the same performance. Each circuit/system layer can be optimized since it can be fabricated using a different technology. The 3D-DWT architecture consists of two processing elements (PE): a PE-odd (processing elements-odd) and a PE-even (processing elements-even) layer. Each layer processes pixel data derived from rows of the y axis, scanning from left to right side of the image data. Each layer operates in parallel yielding high throughput. The architecture can be used to compress medical image such as X-ray, MRI, NRI, CT and endoscopy by processing images frame by frame. |
| first_indexed | 2024-12-21T12:21:43Z |
| format | Article |
| id | doaj.art-c82989c2d6f74783a5e839cba8a182ad |
| institution | Directory Open Access Journal |
| issn | 1690-4524 |
| language | English |
| last_indexed | 2024-12-21T12:21:43Z |
| publishDate | 2009-10-01 |
| publisher | International Institute of Informatics and Cybernetics |
| record_format | Article |
| series | Journal of Systemics, Cybernetics and Informatics |
| spelling | doaj.art-c82989c2d6f74783a5e839cba8a182ad2022-12-21T19:04:18ZengInternational Institute of Informatics and CyberneticsJournal of Systemics, Cybernetics and Informatics1690-45242009-10-01759194Image Processor Using 3D-DWT as Part of Health Care Management SystemKyung-Chang Park0Yun-Ki Hong1Sang-Jin Lee2Yeon-Ho Kim3Younggap You4Tae Won Cho5Kyoung-Rok Cho6Kamran Eshraghian7 Chungbuk National University Chungbuk National University Chungbuk National University Chungbuk National University Chungbuk National University Chungbuk National University Chungbuk National University Chungbuk National University This paper presents a low power and high speed 3D-DWT (three-dimensional discrete wavelet transform) architecture using stacked silicon dies for image compression of medical images. The interconnections of stacked chips are based on TSV (through silicon via) techniques. Its low power operation is due to short signal paths between layers. The area of 3D architecture is much smaller than that of 2D counterpart having the same performance. Each circuit/system layer can be optimized since it can be fabricated using a different technology. The 3D-DWT architecture consists of two processing elements (PE): a PE-odd (processing elements-odd) and a PE-even (processing elements-even) layer. Each layer processes pixel data derived from rows of the y axis, scanning from left to right side of the image data. Each layer operates in parallel yielding high throughput. The architecture can be used to compress medical image such as X-ray, MRI, NRI, CT and endoscopy by processing images frame by frame.http://www.iiisci.org/Journal/CV$/sci/pdfs/XS576UU.pdf WaveletTsvImage Compression3d-DwtStacked Chip |
| spellingShingle | Kyung-Chang Park Yun-Ki Hong Sang-Jin Lee Yeon-Ho Kim Younggap You Tae Won Cho Kyoung-Rok Cho Kamran Eshraghian Image Processor Using 3D-DWT as Part of Health Care Management System Journal of Systemics, Cybernetics and Informatics Wavelet Tsv Image Compression 3d-Dwt Stacked Chip |
| title | Image Processor Using 3D-DWT as Part of Health Care Management System |
| title_full | Image Processor Using 3D-DWT as Part of Health Care Management System |
| title_fullStr | Image Processor Using 3D-DWT as Part of Health Care Management System |
| title_full_unstemmed | Image Processor Using 3D-DWT as Part of Health Care Management System |
| title_short | Image Processor Using 3D-DWT as Part of Health Care Management System |
| title_sort | image processor using 3d dwt as part of health care management system |
| topic | Wavelet Tsv Image Compression 3d-Dwt Stacked Chip |
| url | http://www.iiisci.org/Journal/CV$/sci/pdfs/XS576UU.pdf
|
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