Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound
The warpage behavior of electronic packages has become complicated in recent years owing to the miniaturization and heterogeneous integration technologies. Therefore, stress analyses through warpage simulations have become increasingly challenging. Understanding the thermo-mechanical behavior of epo...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-08-01
|
| Series: | Polymer Testing |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S0142941823002209 |