Confidence Interval Based Fuzzy Evaluation Model for an Integrated-Circuit Packaging Molding Process
The electronics industry in Taiwan has achieved a complete information and communication technology chain with a firm position in the global electronics industry. The integrated-circuit (IC) packaging industry chain adopts a professional division of labor model, and each process (including wafer dic...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-06-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/9/13/2623 |