Microstructure and mechanical performance of dissimilar material joints of 2024Al and SiO2 glass by ultrasonic assisted soldering with Cu interlayer
Ultrasonic assisted soldering was used to join SiO2 glass and 2024Al with Sn solder. The soldering temperature and pressure were set at 300 °C and 0.2 MPa respectively. The Sn solder had good wettability on the SiO2 glass surface by ultrasonic cavitation. At the same time, ultrasonic accelerated the...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2022-05-01
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| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785422004628 |