Liquid metal compartmented by polyphenol‐mediated nanointerfaces enables high‐performance thermal management on electronic devices

Liquid metal compartmented by polyphenol‐mediated nanointerfaces enables high‐performance thermal management on electronic devices

Abstract The exponentially increasing heat generation in electronic devices, induced by high power density and miniaturization, has become a dominant issue that affects carbon footprint, cost, performance, reliability, and lifespan. Liquid metals (LMs) with high thermal conductivity are promising ca...

Szczegółowa specyfikacja

Opis bibliograficzny
Główni autorzy: Chaojun Zhang, Yang Tang, Tianyu Guo, Yizhou Sang, Ding Li, Xiaoling Wang, Orlando J. Rojas, Junling Guo
Format: Artykuł
Język:English
Wydane: Wiley 2024-01-01
Seria:InfoMat
Hasła przedmiotowe:
Electronic devices
High thermal conductivity
Liquid metals
Natural polyphenols
Thermal management
Dostęp online:https://doi.org/10.1002/inf2.12466

Internet

https://doi.org/10.1002/inf2.12466

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