Liquid metal compartmented by polyphenol‐mediated nanointerfaces enables high‐performance thermal management on electronic devices

Liquid metal compartmented by polyphenol‐mediated nanointerfaces enables high‐performance thermal management on electronic devices

Abstract The exponentially increasing heat generation in electronic devices, induced by high power density and miniaturization, has become a dominant issue that affects carbon footprint, cost, performance, reliability, and lifespan. Liquid metals (LMs) with high thermal conductivity are promising ca...

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Bibliographic Details
Main Authors: Chaojun Zhang, Yang Tang, Tianyu Guo, Yizhou Sang, Ding Li, Xiaoling Wang, Orlando J. Rojas, Junling Guo
Format: Article
Language:English
Published: Wiley 2024-01-01
Series:InfoMat
Subjects:
Electronic devices
High thermal conductivity
Liquid metals
Natural polyphenols
Thermal management
Online Access:https://doi.org/10.1002/inf2.12466

Internet

https://doi.org/10.1002/inf2.12466

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