Cutting-based single atomic layer removal mechanism of monocrystalline copper: edge radius effect
Abstract The ultimate objective of mechanical cutting is to down minimum chip thickness to single atomic layer. In this study, the cutting-based single atomic layer removal mechanism on monocrystalline copper is investigated by a series of molecular dynamics analysis. The research findings report th...
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
SpringerOpen
2019-12-01
|
| Series: | Nanoscale Research Letters |
| Subjects: | |
| Online Access: | https://doi.org/10.1186/s11671-019-3195-4 |