Mechanical properties and microstructure evolution of Cu/Sn58Bi/Cu solder joint reinforced by B4C nanoparticles
The mechanical mixed Sn58Bi solder reinforced by B4C nanoparticles for the interconnect of Cu/Cu same metal was studied. The hardness of solder alloy and shear strength of joints with Sn58Bi-xB4C (x = 0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) composite solder were tested. The feasibility of the solution was v...
| Main Authors: | , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2023-03-01
|
| Series: | Journal of Materials Research and Technology |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785423000777 |