Transient liquid phase bonding of silicon and direct bond copper via electroplating of tin-copper interlayers for power device applications
Joining technology of silicon semiconductors devices to direct bond copper (DBC) substrates in high-temperature power electronics packages is of utmost importance today. In this study, Sn–Cu solder was prepared by electroplating on a direct bonded copper (DBC) substrate. The electroplated DBC system...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2021-01-01
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| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/abd5d9 |