Tribological, mechanical and thermal response of diamond micro-particles reinforced copper matrix composites fabricated by powder metallurgy
Copper/Diamond composites have gained a lot of attention in recent years due to their excellent thermal conductivity and their potential for use in high-power electronic devices. The current work targets on an experimental investigation of the tribological,mechanical, and thermal behaviour of copper...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IOP Publishing
2023-01-01
|
| Series: | Materials Research Express |
| Subjects: | |
| Online Access: | https://doi.org/10.1088/2053-1591/acb1a0 |