TCI Tester: A Chip Tester for Inductive Coupling Wireless Through-Chip Interface
The building block computation system is constructed by stacking various chips three-dimensionally. The stacked chips incorporate the same TCI IP (Through Chip Interface Intellectual Property) but cannot provide identical characteristics, requiring adjustments in power supply and bias voltage. Howev...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2023-08-01
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| Series: | Journal of Low Power Electronics and Applications |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2079-9268/13/3/48 |