Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon)

Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon)

We have developed the cooling unit for high-density packaging ICT racks by using the boiling heat transfer with the concept of transporting a heat generated from CPU into the outdoor atmosphere directly without exposure to air in the computer room. The aim of this paper is to evaluate the cooling an...

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Bibliographic Details
Main Authors: Takayuki FUJIMOTO, Fumio TAKEDA, Yoshihiro KONDO, Tatsuo FUJII, Takeshi KATO
Format: Article
Language:Japanese
Published: The Japan Society of Mechanical Engineers 2014-07-01
Series:Nihon Kikai Gakkai ronbunshu
Subjects:
thermosyphon
boiling
condensation
1u server
high-density packaging ict rack
data center
Online Access:https://www.jstage.jst.go.jp/article/transjsme/80/815/80_2014tep0202/_pdf/-char/en

Internet

https://www.jstage.jst.go.jp/article/transjsme/80/815/80_2014tep0202/_pdf/-char/en

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