Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon)
We have developed the cooling unit for high-density packaging ICT racks by using the boiling heat transfer with the concept of transporting a heat generated from CPU into the outdoor atmosphere directly without exposure to air in the computer room. The aim of this paper is to evaluate the cooling an...
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | Japanese |
| Published: |
The Japan Society of Mechanical Engineers
2014-07-01
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| Series: | Nihon Kikai Gakkai ronbunshu |
| Subjects: | |
| Online Access: | https://www.jstage.jst.go.jp/article/transjsme/80/815/80_2014tep0202/_pdf/-char/en |
| _version_ | 1811225012207616000 |
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| author | Takayuki FUJIMOTO Fumio TAKEDA Yoshihiro KONDO Tatsuo FUJII Takeshi KATO |
| author_facet | Takayuki FUJIMOTO Fumio TAKEDA Yoshihiro KONDO Tatsuo FUJII Takeshi KATO |
| author_sort | Takayuki FUJIMOTO |
| collection | DOAJ |
| description | We have developed the cooling unit for high-density packaging ICT racks by using the boiling heat transfer with the concept of transporting a heat generated from CPU into the outdoor atmosphere directly without exposure to air in the computer room. The aim of this paper is to evaluate the cooling and power saving performance of the cooling unit using the low height type thermosyhon installed in the 1U server and the heat exchanger cooled by the water from the outdoor chiller unit. First, we clarified some factors (tilt angle, flow passage length and cross sectional area of thermosyhon) influencing the cooling performance. Then we examined the power saving performance of this cooling system during operating 32 CPUs in the ICT rack and compared to the conventional system using the computer room air conditioner. |
| first_indexed | 2024-04-12T08:59:48Z |
| format | Article |
| id | doaj.art-ce0f779e44a84a5d9d1cb760b4a3ba43 |
| institution | Directory Open Access Journal |
| issn | 2187-9761 |
| language | Japanese |
| last_indexed | 2024-04-12T08:59:48Z |
| publishDate | 2014-07-01 |
| publisher | The Japan Society of Mechanical Engineers |
| record_format | Article |
| series | Nihon Kikai Gakkai ronbunshu |
| spelling | doaj.art-ce0f779e44a84a5d9d1cb760b4a3ba432022-12-22T03:39:17ZjpnThe Japan Society of Mechanical EngineersNihon Kikai Gakkai ronbunshu2187-97612014-07-0180815TEP0202TEP020210.1299/transjsme.2014tep0202transjsmeCooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon)Takayuki FUJIMOTO0Fumio TAKEDA1Yoshihiro KONDO2Tatsuo FUJII3Takeshi KATO4Hitachi, Ltd. Hitachi Research LaboratoryHitachi, Ltd. Hitachi Research LaboratoryHitachi, Ltd. Hitachi Research LaboratoryHitachi, Ltd. Hitachi Research LaboratoryHitachi, Ltd. Central Research LaboratoryWe have developed the cooling unit for high-density packaging ICT racks by using the boiling heat transfer with the concept of transporting a heat generated from CPU into the outdoor atmosphere directly without exposure to air in the computer room. The aim of this paper is to evaluate the cooling and power saving performance of the cooling unit using the low height type thermosyhon installed in the 1U server and the heat exchanger cooled by the water from the outdoor chiller unit. First, we clarified some factors (tilt angle, flow passage length and cross sectional area of thermosyhon) influencing the cooling performance. Then we examined the power saving performance of this cooling system during operating 32 CPUs in the ICT rack and compared to the conventional system using the computer room air conditioner.https://www.jstage.jst.go.jp/article/transjsme/80/815/80_2014tep0202/_pdf/-char/enthermosyphonboilingcondensation1u serverhigh-density packaging ict rackdata center |
| spellingShingle | Takayuki FUJIMOTO Fumio TAKEDA Yoshihiro KONDO Tatsuo FUJII Takeshi KATO Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon) Nihon Kikai Gakkai ronbunshu thermosyphon boiling condensation 1u server high-density packaging ict rack data center |
| title | Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon) |
| title_full | Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon) |
| title_fullStr | Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon) |
| title_full_unstemmed | Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon) |
| title_short | Cooling unit for high-density packaging ICT rack by using boiling heat transfer (Evaluation on basic cooling performance of low height type thermosyphon) |
| title_sort | cooling unit for high density packaging ict rack by using boiling heat transfer evaluation on basic cooling performance of low height type thermosyphon |
| topic | thermosyphon boiling condensation 1u server high-density packaging ict rack data center |
| url | https://www.jstage.jst.go.jp/article/transjsme/80/815/80_2014tep0202/_pdf/-char/en |
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