Thermal and hydrodynamic management of a finned-microchannel heat sink applying artificial neural network

Thermal and hydrodynamic management of a finned-microchannel heat sink applying artificial neural network

Thermal management of microelectronic circuits will be one of the most difficult challenges facing engineering processes in the near future. High operating temperatures in these devices can degrade the reliability of the components and reduce their life. Therefore, effective cooling technologies tha...

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Bibliographic Details
Main Authors: Xiaoqin Wang, Zhanguo Su, Ibrahim B. Mansir, Pradeep Kumar Singh, Nashwan Adnan Othman, Lei Zhang, Mingkui Li, Mahmood Shaker Albdeiri, H. Elhosiny Ali, Mahidzal Dahari, Ahmed Deifalla
Format: Article
Language:English
Published: Elsevier 2023-05-01
Series:Case Studies in Thermal Engineering
Subjects:
Annular microchannel heat sink
Relative efficiency index
Artificial neural network
Heat transfer management
Fin geometry
Online Access:http://www.sciencedirect.com/science/article/pii/S2214157X23003027

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http://www.sciencedirect.com/science/article/pii/S2214157X23003027

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