Reliability Assessment for Trust Integrated Circuit Al Interconnections at Elevated Temperatures

Reliability Assessment for Trust Integrated Circuit Al Interconnections at Elevated Temperatures

The process of recrystallization occurring at temperature of +80°C in aluminum (Al) conductors of integrated circuits (IC) designed to operate in the range -40°C -+60°C has been studied experimentally by the method of cross sections obtained with a focused ion beam (FIB). Using the data of a compara...

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Bibliographic Details
Main Authors: Michael S. Afanasiev, Alexey V. Bespalov, Andrey A. Geraskin, Olga L. Golykova, Dmitry V. Kulikov, Alexandra A. Muravyeva, Dmitry O. Smirnov, Igor A. Kharitonov, Ruslan S. Shabardin
Format: Article
Language:English
Published: Joint Stock Company "Experimental Scientific and Production Association SPELS 2023-09-01
Series:Безопасность информационных технологий
Subjects:
integrated circuit, interconnector, temperature, recrystallization, electromigration, temperature, diffusion, reliability.
Online Access:https://bit.spels.ru/index.php/bit/article/view/1538

Internet

https://bit.spels.ru/index.php/bit/article/view/1538

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