Fine Electrolytic Tough Pitch Copper Multistage Wiredrawing Pass Schedule Design by Analytical and Numerical Methods
Electrolytic tough pitch copper is commonly used in electric and electronic applications while fine copper wires are widely used in electronic conductors. A multi-pass wiredrawing process was designed for the manufacturing of fine pure copper wire, from 0.50 mm to 0.10 mm in diameter. The analytical...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-12-01
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| Series: | Proceedings |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2504-3900/63/1/12 |